C/ Lago Constanza, 46
28017     Madrid

Tel: 91 408 16 25
Fax: 91 408 16 90

10:00 - 13:30 horas
14:30 - 17:30 horas
de lunes a viernes.



RF Plasma Etchers/Plasma Reactors


RF plasma allows the low-temperature modification of a wide range of specimens and substrates. Plasma etching is generally confined to the semiconductor industry, typically for the removal of silicon layers using reactive gases, such as CF4 and for the removal of Photoresist using oxygen.

Plasma ashing refers to the controlled, low-temperature removal of organic material using oxygen or air and has applications across many areas of research and quality control. RF plasma can also be used for the surface modification of plastics and polymers, and for cleaning TEM and SEM specimens and specimen holders.

The K1050X Plasma Etcher/Asher/Cleaner is a compact, bench-top system designed for research and development, and some small scale production applications.


K1050X Plasma Etcher/Asher/Cleaner
K1050X Plasma Etcher/Asher/Cleaner


Para información adicional de nuestros equipos, accesorios o productos llámenos al 91 408 16 25
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